remote
SM CMP Equipment Engineer - Texas Instruments
Software Engineer
Lead the design, operation, and optimization of Chemical Mechanical Planarization (CMP) equipment, ensuring high‑yield, defect‑free semiconductor manufacturing through advanced process control and data‑driven troubleshooting.
About the role
Key Responsibilities
- Design, implement, and maintain CMP equipment for semiconductor fabrication, ensuring compliance with process specifications.
- Analyze process data, perform root‑cause investigations, and develop corrective actions to improve yield and reduce defects.
- Collaborate with cross‑functional teams (Process, Reliability, and R&D) to integrate new technologies and optimize equipment performance.
- Lead equipment calibration, preventive maintenance, and troubleshooting, ensuring minimal downtime and high reliability.
- Document procedures, generate technical reports, and present findings to senior management.
Requirements
- Bachelor’s degree in Mechanical, Electrical, or Chemical Engineering (or related field).
- 3+ years of experience in semiconductor equipment engineering, preferably with CMP or planarization tools.
- Strong analytical skills with proficiency in data analysis tools (e.g., MATLAB, Python).
- Excellent problem‑solving, communication, and teamwork abilities.
- Knowledge of SEM, metrology, and process control principles is a plus.