remote
Senior Engineer, Semiconductor Packaging - Analog Devices
Software Engineer
Lead the design and development of advanced semiconductor packaging solutions, driving innovation in 3D IC, flip‑chip, and TSV technologies while ensuring reliability, thermal performance, and manufacturability.
About the role
Key Responsibilities
- Design and validate advanced packaging structures for high‑performance semiconductor devices, including 3D IC, flip‑chip, and TSV technologies.
- Collaborate with process, design, and reliability teams to integrate packaging solutions into the product development lifecycle.
- Utilize CAD and simulation tools to model mechanical, thermal, and electrical behavior, optimizing package performance and yield.
- Lead failure analysis and reliability testing, implementing corrective actions to meet stringent industry standards.
- Develop and maintain packaging specifications, process documentation, and design guidelines for cross‑functional teams.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
- 5+ years of experience in semiconductor packaging design and development.
- Proficiency with CAD tools (e.g., Cadence, Synopsys) and thermal/structural simulation software.
- Strong understanding of reliability testing, failure analysis, and packaging process integration.
- Excellent communication skills and ability to work collaboratively in a multidisciplinary environment.
Skills
mechanical engineeringelectrical engineering