Senior ASIC Package Design Automation and AI Engineer - AMD

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology can change lives for the better. It can heal us, entertain us, and make us more connected, productive, and understanding of the world around us. And we’re looking for talent who feel the same: people who want to leave the planet better than they found it, those who don’t shy away from humanity’s challenges but are determined to help solve them.

AMD is powering the next generation of supercomputing, high-performance computing, cloud, and AI. Whether you’re designing next-gen processors, enabling AI breakthroughs, or creating go-to-market plans, every role at AMD contributes to something bigger — technology that moves the world forward.

THE ROLE:

We are seeking a highly motivated and seasoned engineer to support the package design organization in the development and deployment of AI-driven automation workflows . This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design.

The candidate will contribute to accelerating the design of advanced heterogeneous integration technologies, including substrates, silicon interposers, and bridge-based architectures, through automation, and AI-enabled methodologies . This role operates in a fast-paced, results-oriented environment and plays a critical part in enabling next-generation packaging innovation.

THE PERSON:

The ideal candidate :

• Translate complex design challenges into scalable automation solutions
• Work effectively across Design, EDA, and AI/ML teams
• Demonstrate strong problem-solving skills and ownership mindset
• Operate with limited supervision, delivering high-quality results aligned to project goals
• The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders.

KEY RESPONSIBILITIES:

• Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration.
• Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification.
• Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality.
• Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement
• Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams
• Support execution of design milestones and tape-outs, ensuring automation readiness and quality