Nanofabrication and Semiconductor Package Failure Analysis Engineer - National Institute of Standards and Technology

Key Responsibilities

• Design and execute failure analysis experiments on semiconductor packages using SEM, TEM, FIB, and EDS.
• Perform root‑cause investigations to identify defect origins and recommend design or process improvements.
• Collaborate with research teams to develop advanced packaging concepts and validate their reliability.
• Analyze and interpret complex data sets, producing detailed technical reports and presentations.
• Maintain and calibrate high‑resolution microscopy equipment, ensuring optimal performance.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
• Proven experience in semiconductor failure analysis and nanofabrication techniques.
• Strong proficiency with SEM, TEM, FIB, and EDS instrumentation.
• Excellent analytical, problem‑solving, and communication skills.
• Ability to work independently and as part of a multidisciplinary research team.