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Engineering Project Manager - Photonic Integrated Circuit Fabrication - Nokia
Software Engineer
Lead end‑to‑end development of photonic integrated circuit (PIC) fabrication projects, coordinating hardware, process, and software teams to deliver low‑latency optical solutions for AI infrastructure.
About the role
Key Responsibilities
- Plan, execute, and deliver PIC fabrication projects on schedule and within budget, aligning with AI infrastructure roadmaps.
- Coordinate cross‑functional teams—including design, process engineering, test, and software—to ensure seamless integration of optical components.
- Apply Agile and stage‑gate methodologies to track progress, mitigate risks, and adapt to evolving technical requirements.
- Drive technical decision‑making on photonic design, wafer processing, and packaging to meet performance and reliability targets.
- Communicate project status, milestones, and technical challenges to senior leadership and external partners.
Requirements
- 5+ years of engineering project management experience in semiconductor or photonics manufacturing.
- Strong background in photonic integrated circuit design and fabrication processes.
- Proven ability to lead multi‑disciplinary teams using Agile or similar frameworks.
- Excellent communication and stakeholder‑management skills.
- Bachelor’s degree in Electrical Engineering, Physics, or related field; advanced degree preferred.
Skills
jiraagileproject management