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Advanced Packaging Singulation Module Engineering Manager - Intel Corporation
Engineering Manager
Lead a high‑performance engineering team focused on advanced packaging singulation modules, driving process development, reliability, and high‑volume manufacturing for cutting‑edge semiconductor products.
About the role
Key Responsibilities
- Lead and mentor a multidisciplinary engineering team delivering singulation solutions for advanced packaging modules.
- Define and execute development roadmaps that enable high‑volume manufacturing while meeting reliability and performance targets.
- Collaborate with design, process, and test groups to integrate singulation technologies into product flows.
- Manage project schedules, resources, and risk mitigation to ensure on‑time delivery of milestones.
- Drive continuous improvement initiatives, leveraging data analytics and root‑cause analysis to enhance yield and cost efficiency.
Requirements
- Bachelor’s or higher in Electrical Engineering, Materials Science, or related field with 8+ years of semiconductor packaging experience.
- Proven track record leading engineering teams in high‑volume manufacturing environments.
- Deep expertise in singulation processes, advanced packaging technologies, and reliability testing.
- Strong project management skills, including budgeting, scheduling, and cross‑functional coordination.
- Excellent communication and problem‑solving abilities, with a focus on results‑driven innovation.