Engineer Post Silicon- Bring Up with 7+ years in Post-Silicon Validation & Debug
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Silicon Bring-up and Hardware Validation Engineer with 7+ years of experience in post-silicon validation, silicon validation, board bring-up, board debug, reliability engineering, and system-level validation across NVIDIA, Micron, and SanDisk. Experienced in driving validation execution for GPU/SoC and storage products, coordinating with cross-functional hardware and software teams, and supporting product qualification through structured debug, failure analysis, issue triage, and root cause isolation. Strong hands-on expertise in lab tools, validation workflows, and industry standards including UFS, USB, NAND, and JEDEC-based qualification.
Dayananda Sagar College of Engineering (VTU)
B.E · Electronics and Communication Engineering
August 1, 2015 – June 30, 2019
T.M.A.E.S Polytechnic (DTE)
Diploma · Electronics and Communication Engineering
August 1, 2013 – June 30, 2016
NVIDIA
Silicon Bring-up Engineer
February 1, 2024 – Present
Bengaluru, Karnataka, India
Micron
Reliability Engineer
August 1, 2022 – February 1, 2024
Hyderābād, Telangana, India
SanDisk
Reliability Engineer
August 1, 2019 – August 1, 2022
Bengaluru, Karnataka, India
Cultural Fit Analysis
The candidate has worked at three major semiconductor companies (NVIDIA, Micron, SanDisk), indicating adaptability to different corporate cultures and validation methodologies. Their experience spans GPU/SoC and storage products, showing a broad technical interest and ability to integrate into diverse product development environments. The focus on structured validation and adherence to JEDEC standards suggests a commitment to quality and process, which aligns well with established engineering cultures.
Soft Skills & Operational Fit
The candidate demonstrates strong collaboration skills through coordinating with cross-functional teams and training contractors. Their experience in driving debug activities and supporting product qualification indicates a proactive and problem-solving operational fit. The ability to enable teams across multiple sites suggests good communication and leadership potential.