Rohan Desai
Backend EngineerAI is analyzing your overall score…
Identifying your key strengths…
Evaluating your skill match against the job requirements…
Assessing your cultural and operational fit
AI is analyzing your overall score…
Identifying your key strengths…
Evaluating your skill match against the job requirements…
Assessing your cultural and operational fit
Engineering Manager - SSP Platform & Infrastructure
I lead infrastructure and an infra-heavy SSP platform powering real-time, latency-sensitive workloads at scale. My focus is on reliability, performance, and cost efficiency, ensuring our systems can support both current and future product initiatives. I am leading multiple cloud-to-bare-metal migrations across high-throughput products, which are projected to deliver approximately $500K–$1M in annualized operational cost savings once complete, while improving latency predictability and system stability. These foundational decisions are enabling downstream initiatives, including ML workloads, to operate reliably and efficiently. I’m passionate about building resilient systems that can scale predictably, and about bridging the gap between business goals and the technical decisions that make them possible.
New York University
Master of Science (M.S.), Computer Science
January 1, 2014 – January 1, 2016
Vellore Institute of Technology
Bachelor of Technology (B.Tech.), Information Technology
January 1, 2010 – January 1, 2014
The COOL Company
Director of Engineering - SSP Platform & Infrastructure
May 1, 2026 – Present
The COOL Company
Engineering Manager - SSP Platform & Infrastructure
March 1, 2024 – June 1, 2026
The COOL Company
Software Architect
September 1, 2021 – February 1, 2024
The COOL Company
Backend Tech Lead
January 1, 2020 – August 1, 2021
The COOL Company
Associate Software Engineer
September 1, 2019 – January 1, 2020
The COOL Company
Associate Software Engineer
June 1, 2018 – August 1, 2019
The COOL Company
Full Stack Developer
June 1, 2016 – May 1, 2018
NYU Tandon School of Engineering
Graduate Teaching Assistant -Programming Languages & Network Security
September 1, 2015 – May 1, 2016
Greater New York City Area
investFeed
Software Developer Summer Intern
June 1, 2015 – August 1, 2015
Greater New York City Area
Tata Steel
Intern
May 1, 2012 – July 1, 2012
Jamshedpur Area, India
Cultural Fit Analysis
The candidate's long tenure and progression within 'The COOL Company' suggest a strong ability to integrate and grow within an organizational culture. The diverse roles, from Full Stack Developer to Director of Engineering, indicate adaptability and a broad understanding of different aspects of software development and management. However, the lack of project details makes it difficult to assess specific contributions or alignment with diverse team environments or innovative project approaches.
Soft Skills & Operational Fit
The candidate's career progression from Associate Software Engineer to Director of Engineering within the same company suggests strong dedication, leadership potential, and ability to adapt to increasing responsibilities. Experience as a Graduate Teaching Assistant indicates communication and mentoring skills. However, without specific project details or descriptions of achievements, it is difficult to fully assess the depth of these soft skills or operational fit beyond what is implied by role titles.